Evaluación experimental de la respuesta térmica superficial de sistemas de conexión en circuitos monofásicos de baja tensión
DOI:
https://doi.org/10.37135/ns.01.18.10Palabras clave:
Baja tensión, Calentamiento localizado, Conectores eléctricos, Elevación térmica, Empalme eléctrico, Termografía infrarrojaResumen
Este estudio evaluó experimentalmente la respuesta térmica superficial de sistemas de conexión empleados en circuitos monofásicos de baja tensión con cargas progresivas. Se analizaron conectores de palanca de dos vías y un empalme de derivación por torsión, instalados en un circuito de 127 V con conductor de cobre calibre 12 AWG. La temperatura superficial del punto de unión y del conductor adyacente se registró mediante termografía infrarroja durante 120 min por condición. El análisis consideró la evolución temporal de la temperatura, la elevación térmica respecto del estado inicial y la propagación superficial del calentamiento hacia el conductor. Los resultados evidenciaron respuestas térmicas diferenciadas aún bajo condiciones eléctricas equivalentes. Los conectores 221-682 y 221-412 presentaron las menores elevaciones térmicas y una propagación más contenida hacia el conductor. El P04-2P mostró una respuesta intermedia, mientras que el empalme de derivación alcanzó una condición intermedia alta. En contraste, el conector genérico registró la condición más crítica, con una temperatura final de 85,1 °C en la condición de mayor carga. Se concluye que la continuidad eléctrica inicial no garantiza un desempeño térmico equivalente entre métodos de unión; por ello, la evaluación debe considerar la temperatura máxima, la evolución temporal, la elevación térmica y la propagación hacia el conductor.
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